Display device

ABSTRACT

A display device is disclosed. In one aspect, the display device includes a substrate including a display area, the display area including a plurality of pixels configured to display an image and a pad area adjacent to the pad area and configured to transfer electrical signals. At least a portion of the pad area is bendable. The display device also includes an insulating layer formed over the substrate and including a bending groove in the pad area. The bending groove includes a sidewall. A plurality of peripheral wires is formed over the insulating layer, and a cutoff portion is connected to the sidewall and disposed between adjacent peripheral wires.

RELATED APPLICATIONS

This application claims priority to and the benefit of Korean PatentApplication No. 10-2015-0113265 filed in the Korean IntellectualProperty Office on Aug. 11, 2015, the entire contents of which areincorporated herein by reference.

BACKGROUND

Field

The described technology generally relates to a display device.

Description of the Related Technology

Display devices like liquid crystal display (LCD), plasma display device(PDP), organic light-emitting diode (OLED) display, electric fieldeffect display, electrophoretic display are facing increased marketdemand.

Such devices include a display panel displaying an image by emitting aplurality of color lights and a window disposed on the display panel andprotecting the display panel. Great strides are being made by furtherincluding a touch panel which provides for receiving an input signal byhuman touch or a handheld input device (e.g., stylus).

At this time, a driving chip is mounted at the periphery of the displaypanel to drive the display panel by transferring a touch signal in orderto emit light using the display panel. To electrically connect to thedisplay panel and the driving chip, a pad electrode is formed on a partof the display panel. The pad electrode is formed of a conductivematerial to electrically connect the display panel and the driving chip.

Market demand for display device with larger display areas isincreasing, and manufacturers are developing display devices that candecrease the ratio of the pad area to display area and increaseperformance of the display.

SUMMARY OF CERTAIN INVENTIVE ASPECTS

One inventive aspect relates to a display device that can decrease anpad area of the display device and prevent a short circuit between thewires.

Another aspect includes a display device with a substrate including adisplay area including a plurality of pixels so as to display an imageand a pad area transferring electrical signals is provided, wherein apart of the pad area can be bent, an insulating layer formed on thesubstrate and including a bending groove in the pad area, a plurality ofperipheral wires formed on the insulating layers, and a cutoff portionprotruded or dented from a sidewall of the bending groove and disposedbetween the plurality of peripheral wires adjacent each other.

The bending groove is disposed at the insulating layer along a directioncrossing a length direction in which the peripheral wires are extended.The cutoff portion is disposed at the same layer as the insulatinglayer.

The cutoff portion is formed of the same material as the insulatinglayer. The cutoff portion is integrally formed with the insulatinglayer.

A width of the cutoff portion is constant from the sidewall to an end ofthe cutoff portion.

A width of the cutoff portion is decreased from the sidewall to an endof the cutoff portion.

The display area includes a display wire extended from the pixel to thepad area, wherein an end of the peripheral wire contacts the displaywire by a first contact hole.

The pad area includes a pad electrode and a pad wire, the other end ofthe peripheral wire contacts the pad wire by a second contact hole, andthe pad electrode contacts the pad wire by a pad contact hole.

The display area is connected with the display wire and includes a thinfilm transistor including a gate electrode, a source electrode, and adrain electrode, and the display wire is made of the same material asthe gate electrode and the peripheral wire is made of the same materialas the source electrode and the drain electrode.

The cutoff portion has a plurality of protrusions protruding from thesidewall to an edge of the pad area at the substrate.

The cutoff portion has a plurality of recesses recessed from thesidewall to an edge of the pad area at the substrate.

The cutoff portion height is equal to or lower than that of theinsulating layer.

Another aspect is a display device comprising: a substrate including adisplay area, the display area including a plurality of pixelsconfigured to display an image and a pad area adjacent to the pad areaand configured to transfer electrical signals, wherein at least aportion of the pad area is bendable; an insulating layer formed over thesubstrate and including a bending groove in the pad area, wherein thebending groove includes a sidewall; a plurality of peripheral wiresformed over the insulating layer; and a cutoff portion connected to thesidewall and disposed between adjacent peripheral wires.

In the above display device, the bending groove extends in a directioncrossing a direction in which the peripheral wires extends.

In the above display device, the cutoff portion is formed on the samelayer as the insulating layer.

In the above display device, the cutoff portion is formed of the samematerial as the insulating layer.

In the above display device, the cutoff portion is integrally formedwith the insulating layer.

In the above display device, the width of the cutoff portion issubstantially the same from the sidewall to an end region of the cutoffportion.

In the above display device, the width of the cutoff portion decreasesfrom the sidewall to an end of the cutoff portion.

In the above display device, the display area includes a display wireextending from the pixel to the pad area, wherein an end region of theperipheral wire contacts the display wire through a first contact hole.

In the above display device, the pad area includes a pad electrode and apad wire, wherein the other end of the peripheral wire contacts the padwire through a second contact hole, and wherein the pad electrodecontacts the pad wire through a pad contact hole.

In the above display device, the display area is connected to thedisplay wire and includes a thin film transistor comprising a gateelectrode, a source electrode, and a drain electrode, wherein thedisplay wire is formed of the same material as the gate electrode, andwherein the peripheral wire is formed of the same material as the sourceand drain electrodes.

In the above display device, the cutoff portion includes a plurality ofprotrusions protruding from the sidewall to an edge of the pad area.

In the above display device, the cutoff portion has a plurality ofrecesses recessed from the sidewall to an edge of the pad area.

In the above display device, the height of the cutoff portion issubstantially equal to or less than that of the insulating layer.

Another aspect is a display device comprising: a substrate including adisplay area configured to display an image and a pad area adjacent tothe pad area and configured to transfer electrical signals to thedisplay area, wherein a portion of the pad area is bendable; aninsulating layer formed over the substrate and including a bendinggroove formed in the pad area, wherein the bending groove includes asidewall; a plurality of display wires formed in the display area; aplurality of peripheral wires formed in the peripheral area andelectrically connected to the display wires; and a cutoff portionextending from the sidewall into the display area or protruding from theinsulation layer in the display area into the sidewall in the peripheralarea, wherein the cutoff portion is interposed between adjacentperipheral wires.

In the above display device, the height of the bending groove is lessthan that of the rest of the insulating layer.

In the above display device, the cutoff portion is substantiallyrectangular.

In the above display device, a selected display wire and a selectedperipheral wire overlap in an overlap region in the display area,wherein the overlap region has a length that is less than that of thecutoff portion.

In the above display device, the cutoff portion is substantiallytriangular.

In the above display device, the sidewall overlaps a selected peripheralwire in the depth dimension of the display device.

In the above display device, the width of the cutoff portion is lessthan the width of the peripheral wire.

According to at least one of the disclosed embodiments, a displaydevice, which can decrease a probability of damage to the display devicebecause of a modulus difference of each of insulation layers formed bystacking a plurality of layers in a bending groove formed by removing apart of the insulating layer corresponding to a bending area of a padarea of the display device when the display device is bent, is provided.

In addition, a display device reducing a probability of a short-circuitbetween a plurality of peripheral wires by the cutoff portion isprovided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a top plan view of a display device according to anexemplary embodiment.

FIG. 2 illustrates a side view showing a bending state of the displaydevice of an exemplary embodiment.

FIG. 3 illustrates an enlarged view of an A area in FIG. 1 of thedisplay device according to a first exemplary embodiment.

FIG. 4 illustrates a cross-sectional view cutting along an IV-IV line inFIG. 3.

FIG. 5 illustrates an enlarged view of a B area in FIG. 3.

FIG. 6 illustrates an enlarged view of the B area in FIG. 3 of thedisplay device according to a second exemplary embodiment.

FIG. 7 illustrates an enlarged view of the B area in FIG. 3 of thedisplay device according to a third exemplary embodiment.

FIG. 8 illustrates an enlarged view of the B area in FIG. 3 of thedisplay device according to a fourth exemplary embodiment.

FIG. 9 illustrates a cross-sectional view showing a part of a pixel in adisplay area of the display device according to an exemplary embodiment.

DETAILED DESCRIPTION OF CERTAIN INVENTIVE EMBODIMENTS

Hereinafter, referring to the drawings, exemplary embodiments will bedescribed in detail. However, in describing the present technology, adescription of already known functions or configurations will be omittedso as to make the subject matter of the present technology more clear.

Parts unrelated to the description of the exemplary embodiments are notshown in the drawings to make the descriptions more clear, and likereference numerals designate like element throughout the specification.In addition, the size and thickness of each configuration shown in thedrawings are arbitrarily shown for better understanding and ease ofdescription, but the present technology is not limited thereto.

In the drawings, the thickness of layers, films, panels, regions, etc.,are exaggerated for clarity. In the drawings, for understanding and easeof description, the thickness of some layers and areas is exaggerated.In this disclosure, the term “substantially” includes the meanings ofcompletely, almost completely or to any significant degree under someapplications and in accordance with those skilled in the art. Moreover,“formed, disposed or positioned over” can also mean “formed, disposed orpositioned on.” The term “connected” includes an electrical connection.

FIG. 1 illustrates a top plan view of a display device 100 according toan exemplary embodiment. FIG. 2 illustrates a side view showing abending state of the display device 100 of an exemplary embodiment.

A display device 100 according to an exemplary embodiment includes asubstrate 110, an insulating layer 120, a plurality of peripheral wires124, and a cutoff portion 126.

As Illustrated in FIG. 1, the substrate 110 of the present exemplaryembodiment includes a display area DA and a pad area PA which aredistinguishable by each of their functions. The display area DA is anarea formed in an area of the substrate 110 and including a plurality ofpixels PX so as to display images, and the pad area PA is an areareceiving electrical signals transferred from the outside to the displayarea by being electrically connected with a chip on film COF and aflexible printed circuit board FPCB.

The substrate 110 according to the present exemplary embodiment can be aplastic film formed of a flexible material like polyimide orpolycarbonate. Therefore, the substrate 110 of the present exemplaryembodiment can allow a part of the pad area PA to be bent as illustratedin FIG. 2.

The insulating layer 120 is formed on the substrate 110 of the presentexemplary embodiment. The insulating layer 120 protects the substrate110 by preventing moisture and oxygen from permeating from the outside.The insulating layer 120 is formed by stacking organic layers orinorganic layers, or by alternately stacking an organic layer and aninorganic layer.

For example, the insulating layer 120 of the present exemplaryembodiment includes a barrier layer 120 a, a buffer layer (not shown),gate insulating layers 120 b and 120 c, and an interlayer insulatinglayer 120 d on the substrate 110.

The barrier layer 120 a is formed by stacking a plurality of organiclayers or inorganic layers, or by alternately stacking an organic layerand an inorganic layer. The barrier layer 120 a is formed of a materialhaving lower moisture permeability and oxygen transmittance than thesubstrate 110, so that the moisture and oxygen permeating the substrate110 cannot permeate a light emitting element 30. Regarding the lightemitting element 30, it is described for example below in a partrelating to FIG. 9.

The buffer layer (not shown) is also formed by stacked a plurality oforganic layers or inorganic layers, like the barrier layer 120 a. Thebuffer layer provides a substantially flat surface in order to form apixel circuit at the light emitting element 30 in the display area DAand prevent the moisture and the impurities from permeating into thepixel circuit and the light emitting element 30.

The gate insulating layers 120 b and 120 c are formed on the bufferlayer by an organic layer or an inorganic layer so that gate wiresincluding a gate line (not shown), a gate electrode 32, and a gate pad(not shown) are insulated from conductive materials of other layers.Although not illustrated in the drawings, the gate line of the presentexemplary embodiment includes a first gate line and a second gate lineformed in a different layer from the first gate line, such that thefirst gate insulating layer 120 b and the second gate insulating layer120 c are formed to correspond to the first gate line and the secondgate line.

The interlayer insulating layer 120 d is formed on the gate insulatinglayers 120 b and 120 c and is mainly formed by an organic layer, but isnot limited thereto. The interlayer insulating layer 120 d is formedbetween a data wire including a data line (not shown), a data pad (notshown), a source electrode 33, and a drain electrode 34, and the gatewire, so that the interlayer insulating layer 120 d insulates the gatewire and the data wire from each other.

When a typical display device is bent, problems can occur such as damageto the display device when the display device is bent or a large modulusdifference which can make the display device not easily bent betweeneach of the layers because a thickness of the insulating layer is toothick by stacking a plurality of organic layers or inorganic layers.

Thus, the display device 100 of the present exemplary embodimentincludes a bending groove BD formed by removing a part of the insulatinglayer 120 corresponding to a bending area of the display device 100.Because the bending groove BD is formed by removing a part of theinsulating layer 120, a sidewall 128 can be formed by a step with theinsulating layer 120 which is not removed.

In this case, the bending groove BD of the present exemplary embodimentcan be formed by removing a part of the barrier layer 120 a, the bufferlayer (not shown), the gate insulating layers 120 b and 120 c, and theinterlayer insulating layer 120 d included in the insulating layer 120,or all of the insulating layer 120 in order to expose the substrate 110.

FIG. 2 and FIG. 4 illustrate the bending groove BD formed by removingthe buffer layer, the gate insulating layers 120 b and 120 c, and theinterlayer insulating layer 120 d and maintaining the barrier layer 120a among the insulating layer 120.

However, this embodiment is just one example, and it is possible thatonly the barrier layer 120 a can be removed or only the interlayerinsulating layer 120 d can be removed while maintaining the buffer layer(not shown) or gate insulating layers 120 b and 120 c, as describedabove.

The cutoff portion 126 is formed at the sidewall of the bending grooveBD. The cutoff portion 126 protrudes or is recessed from the sidewall128 of the bending groove BD to an edge of the pad area at thesubstrate.

FIG. 3 illustrates a part of the pad area PA and the display area DAincluding a cutoff portion 126 protruding from the sidewall 128 of thebending groove BD according to a first exemplary embodiment. FIG. 4illustrates a cross-sectional view cutting along an IV-IV line in FIG.3.

The word “protrude” can mean that the cutoff portion 126 extends towardthe edge in a pad area PA of the substrate 110. For example, it meansthat the cutoff portion 126 extends toward an empty space that is openedby removing the insulating layer 120 at the bending groove BD from thesidewall 128 of the bending groove BD that is maintained in theinsulating layer 120.

A plurality of peripheral wires 124 are formed on the insulating layer120 including the bending groove BD of the present exemplary embodiment.The peripheral wires 124 electrically connect a plurality of displaywires in a display area DA and a plurality of pad electrodes 140 in apad area PA.

As illustrated in FIG. 3 and FIG. 4, an end of the peripheral wire 124is electrically connected with a display wire 130 by contacting througha first contact hole 124 a, and the other end of the peripheral wire 124is electrically connected with a pad wire 136 in the pad area PA bycontacting through a second contact hole 124 b.

The pad wire 136 contacts a pad contact hole 142 and is connected withthe pad electrode 140. The display wire 130 of the present exemplaryembodiment is formed of the same material as the gate wire as describedabove, and the peripheral wire 124 of the present exemplary embodimentis formed of the same material as the data wire as described above.

For example, the display wire 130 includes a first display wire 132 anda second display wire 134 formed on a different layer from the firstdisplay layer 132, and the first display wire 132 and the second displaywire 134 are formed on the same layer and formed of the same material asa first gate line and a second gate line formed on a different layerfrom the first gate line, respectively.

However, it is not limited thereto, and the implemental range of thedescribed technology is not limited even if the peripheral wire 124 isformed of the same material as the gate wire. After forming the displaywire 130 and the peripheral wire 124, a material for forming anelectrode like a pixel electrode 371 or a common electrode 373 can beadded in order to form a pixel in the display area DA as describedregarding FIG. 9.

In this case, the material for forming the electrode that is not removedcan remain in the lower side of the bending groove BD in which a step isformed because the material for forming the electrode is not onlyapplied on the display area (DA) but also on all of the substrate 110.

If the material for forming the electrode remains in the bending grooveBD, the short circuit phenomenon occurs by connecting the peripheralwires 124 by the remaining material for forming the electrode in theinsulating layer 120 including the groove BD, so that the product canhave a defect. Therefore, according to the present exemplary embodiment,a plurality of cutoff portions 126 are formed to prevent the materialfor forming the electrode from remaining in the bending groove BD.

The plurality of cutoff portions 126 according to the present exemplaryembodiment are formed between each of the peripheral wires 124, so thatthe cutoff portions 126 extend the circumferential length of thesidewall 128 of the bending groove BD against the case where the cutoffportion 126 is not formed.

The material for forming the electrode does not remain between theperipheral wires 124, so that the short-circuit phenomenon between theperipheral wires 124 can be prevented because the probability that thematerial for forming the electrode remains on the sidewall 128 in thebending groove BD can decrease by extending the circumferential lengthof the sidewall 128.

The cutoff portion 126 of the present exemplary embodiment can be formedof the same material as the insulating layer 120 and be formedintegrally with the insulating layer 120.

When a part of the insulating layer 120 is removed to form the bendinggroove BD, the bending groove BD can be formed by using a maskcorresponding to a shape of the cutoff portion 126 in order to be formedthe cutoff 126 at the sidewall 128.

In addition, although not illustrated in the drawings, the cutoffportion 126 of the present exemplary embodiment has the same or a lowerheight than the sidewall 128 of the bending groove BD.

For example, when the insulating layer 120 is removed to form thebending groove BD, the cutoff portion 126 is formed by removing theinsulating layer 120 having the same or a lower height than the bendinggroove BD.

As an example, if the interlayer insulating layer 120 d, the gateinsulating layers 120 b and 120 c, and the buffer layer among theinsulating layer 120 are removed to form the bending groove BD, not onlycan all of the interlayer insulating layer 120 d, the gate insulatinglayers 120 b and 120 c, and the buffer layer cutoff portion 126 beremoved to form the bending groove BD, but only the interlayerinsulating layer 120 d can be removed or only the interlayer insulatinglayer 120 d and the gate insulating layers 120 b and 120 c can beremoved.

FIG. 5 to FIG. 8 illustrate various exemplary embodiments of the cutoffportion 126 according to the first exemplary embodiment to the fourthexemplary embodiment.

FIG. 5 illustrates an enlarged view of a B area and a periphery of the Barea in FIG. 3. FIG. 6 to FIG. 8 illustrate other exemplary embodimentsthat are deformable at a position corresponding to FIG. 5.

As illustrated in FIG. 5, the cutoff portion 126 according to the firstexemplary embodiment is formed as the insulating layer 120 protrudesfrom the sidewall 128 of the bending groove BD toward the pad electrode140.

This is identical to that described regarding FIG. 3 and FIG. 4.Meanwhile, FIG. 6 illustrates the cutoff portion 126 according to thesecond exemplary embodiment.

According to the second exemplary embodiment, the cutoff portion 126 isformed as the insulating layer 120 is dented from the sidewall 128 ofthe bending groove BD toward the pad electrode 140.

As illustrated in FIG. 5 and FIG. 6, the width of the cutoff portion 126according to the first exemplary embodiment and the second exemplaryembodiment is kept constant from the sidewall 128 to the end of thecutoff portion 126.

FIG. 7 illustrates the cutoff portion 126 according to the thirdexemplary embodiment. FIG. 7 illustrates the cutoff portion 126 formedas the insulating layer 120 protrudes from the sidewall 128 of thebending groove BD toward the pad electrode 140, like the first exemplaryembodiment.

However, according to the third exemplary embodiment, FIG. 7 illustratesthat the width of the cutoff portion 126 is decreased from the sidewall128 of the bending groove BD to the end of the cutoff portion 126,unlike the first exemplary embodiment.

FIG. 8 illustrates the cutoff portion 126 according to the fourthexemplary embodiment. The cutoff portion 126 illustrated in FIG. 8 isalso formed as a part of the insulating layer 120 that is dented fromthe sidewall 128 of the bending groove BD toward the display area DA,like the second exemplary embodiment, and the width of the cutoffportion 126 is decreased from the sidewall 128 of the bending groove BDto the end of the cutoff portion 126, like the third exemplaryembodiment.

Further, although not illustrated in the drawings, not only can asurface and an edge of the cutoff portion 126 be rounded, but it will beincluded in the exemplary range of the described technology that thelengths or the heights of a plurality of cutoff portions 126 aredifferent from each other.

Meanwhile, FIG. 9 illustrates a pixel PX in the display area DA of thedisplay device 100 according to an exemplary embodiment.

In the pixel PX in FIG. 9, insulating layer 120 including the barrierlayer 120 a, the buffer layer, the gate insulating layers 120 b and 120c, and the interlayer insulating layer 120 d is formed on a substrate110, and an organic emission layer 30 is formed on the insulating layer120.

In this time, a semiconductor layer 31 including a channel region 311, asource region 312, and a drain region 313 is formed on the buffer layer,the gate insulating layers 120 b and 120 c cover the semiconductor layer31, and the gate electrode 32 is formed on the gate insulating layers120 b and 120 c corresponding to the channel region 311.

The interlayer insulating layer 120 d covers the gate electrode 32, anda contact hole is formed in the interlayer insulating layer 120 d sothat the source electrode 33 and the drain electrode 34 are connectedwith the source region 312 and the drain region 313 of the semiconductorlayer 31, respectively.

Then, a planarizing layer 35 is formed on the interlayer insulatinglayer 120 d on which the source electrode 33 and the drain electrode 34are formed in order to flatten the surface. Another contact hole isformed in the planarizing layer 35 so that the pixel electrode 371 andthe drain electrode 34 contact each other. The source electrode 33,semiconductor layer 31, gate electrode 32, and drain electrode 34 can bethin film transistor TFF.

A pixel defining layer 36 opened at the area corresponding to the lightemitting area of the pixel is formed on the planarizing layer 35. Thepixel electrode 371, an organic emission layer 372, and the commonelectrode 373 are stacked sequentially in the opened area of the pixeldefining layer 36 so that the organic light emitting element 37 iscompleted.

A thin film encapsulation layer 38 is formed on the organic lightemitting element 37 to prevent the moisture and the oxygen frompenetrating into the substrate 110 on which the organic light emittingelement 37 is formed.

FIG. 9 illustrates an OLED display including the organic light emittingelement 37 according to an exemplary embodiment. However, the describedtechnology is not limited thereto, and it can be applied to variousdisplay devices like a liquid crystal display LCD, a plasma displaypanel PDP, a field effect display FED, and an electrophoretic display.

According to an exemplary embodiment, the display wire 130 is extendedfrom the pixel PX to display area DA to the pad area PA. The displaywire 130 is the gate line formed in the same layer and of the samematerial as the gate electrode 32 or the data line formed in the samelayer and of the same material as the source electrode 33 and the drainelectrode 34.

In addition, as described above, the gate line can be the first gateline and the second gate line formed at the different layers from eachother. Therefore, the first display wire 132 and the second display wire134 correspond not only to the first gate line and the second gate line,but also to the gate line and the data line.

Meanwhile, the pad wire 136 of the present exemplary embodiment formedin the pad area PA is also formed of the same material as the displaywire 130, and the pad electrode 140 is formed of the same material asthe peripheral wire 124.

Also, the material for forming the pixel electrode is formed on the padelectrode 140 to form the pixel electrode 371 of the display area DA. Itis described above that the display device 100 includes a cutoff portion126 corresponding to the first to fourth exemplary embodiments.

According to the present exemplary embodiment, it can decrease aprobability of damage to the display device because of a modulusdifference of each of the insulation layers formed by stacking aplurality of layers in a bending groove formed by removing a part of theinsulating layer corresponding to a bending area of a pad area of thedisplay device when the display device is bent.

In addition, it can reduce a probability of a short-circuit between theperipheral wires 124 through the pad area PA by forming the cutoffportion 126.

While the inventive technology has been described in connection withwhat is presently considered to be practical exemplary embodiments, itis to be understood that the invention is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

Therefore, changed examples and modified examples should not beappreciated separately from the technical spirit or the viewpoint of thedescribed technology, and it should be appreciated that modifiedexemplary embodiments will be included in the appended claims of thedescribed technology.

What is claimed is:
 1. A display device comprising: a substrateincluding a display area, the display area including a plurality ofpixels configured to display an image and a pad area adjacent to the padarea and configured to transfer electrical signals, wherein at least aportion of the pad area is bendable; an insulating layer formed over thesubstrate and including a bending groove in the pad area, wherein thebending groove includes a sidewall; a plurality of peripheral wiresformed over the insulating layer; and a cutoff portion connected to thesidewall and disposed between adjacent peripheral wires.
 2. The displaydevice of claim 1, wherein the bending groove extends in a directioncrossing a direction in which the peripheral wires extends.
 3. Thedisplay device of claim 1, wherein the cutoff portion is formed on thesame layer as the insulating layer.
 4. The display device of claim 1,wherein the cutoff portion is formed of the same material as theinsulating layer.
 5. The display device of claim 1, wherein the cutoffportion is integrally formed with the insulating layer.
 6. The displaydevice of claim 1, wherein the width of the cutoff portion issubstantially the same from the sidewall to an end region of the cutoffportion.
 7. The display device of claim 1, wherein the width of thecutoff portion decreases from the sidewall to an end of the cutoffportion.
 8. The display device of claim 1, wherein the display areaincludes a display wire extending from the pixel to the pad area, andwherein an end region of the peripheral wire contacts the display wirethrough a first contact hole.
 9. The display device of claim 1, whereinthe pad area includes a pad electrode and a pad wire, wherein the otherend of the peripheral wire contacts the pad wire through a secondcontact hole, and wherein the pad electrode contacts the pad wirethrough a pad contact hole.
 10. The display device of claim 1, whereinthe display area is connected to the display wire and includes a thinfilm transistor comprising a gate electrode, a source electrode, and adrain electrode, wherein the display wire is formed of the same materialas the gate electrode, and wherein the peripheral wire is formed of thesame material as the source and drain electrodes.
 11. The display deviceof claim 1, wherein the cutoff portion includes a plurality ofprotrusions protruding from the sidewall to an edge of the pad area. 12.The display device of claim 1, wherein the cutoff portion has aplurality of recesses recessed from the sidewall to an edge of the padarea.
 13. The display device of claim 1, wherein the height of thecutoff portion is substantially equal to or less than that of theinsulating layer.
 14. A display device comprising: a substrate includinga display area configured to display an image and a pad area adjacent tothe pad area and configured to transfer electrical signals to thedisplay area, wherein a portion of the pad area is bendable; aninsulating layer formed over the substrate and including a bendinggroove formed in the pad area, wherein the bending groove includes asidewall; a plurality of display wires formed in the display area; aplurality of peripheral wires formed in the peripheral area andelectrically connected to the display wires; and a cutoff portionextending from the sidewall into the display area or protruding from theinsulation layer in the display area into the sidewall in the peripheralarea, wherein the cutoff portion is interposed between adjacentperipheral wires.
 15. The display device of claim 14, wherein the heightof the bending groove is less than that of the rest of the insulatinglayer.
 16. The display device of claim 15, wherein the cutoff portion issubstantially rectangular.
 17. The display device of claim 16, wherein aselected display wire and a selected peripheral wire overlap in anoverlap region in the display area, and wherein the overlap region has alength that is less than that of the cutoff portion.
 18. The displaydevice of claim 15, wherein the cutoff portion is substantiallytriangular.
 19. The display device of claim 14, wherein the sidewalloverlaps a selected peripheral wire in the depth dimension of thedisplay device.
 20. The display device of claim 14, wherein the width ofthe cutoff portion is less than the width of the peripheral wire.